2025 OCP APAC Summit Keynote
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2025 OCP APAC Summit Keynote - TSMC
Shang Y. Hou (TSMC)
Advanced CPO Integrated by CoWoS and COUPE
CoWoS is widely used for high performance network switch and AI accelerators. This talk will explore the rationale behind advanced Co-packaged Optics (CPO) based on CoWoS and COUPE, highlighting how these innovations are driving high-bandwidth, energy-efficient data connectivity. I will discuss the current development status, share insights into technical challenges, and provide a forward-looking perspective on future advancements in CPO packaging technology.
2025 OCP APAC Summit Keynote - ASE
Yin Chang (ASE)
Propelling AI forward through Advanced Packaging Creativity
The semiconductor industry is stacked with groundbreaking innovation that is helping to weave intelligence into every dimension of life, through generative, agentic and physical AI models, spanning all the way from the cloud to the edge. Data centers are at the center of it all, housing the infrastructure and networks that push performance boundaries and accelerate business results. But the challenges are real, particularly related to critical power and cooling demands. Heterogeneous Integration through advanced packaging is playing a pivotal role in pushing physical, electrical, and thermal limits to achieve better energy efficiency and greater compute power. During his keynote, Hung will set the stage by exploring the AI and data center landscape, highlighting challenges that require our collective attention, particularly as we move from electrons to photons. He will then expand on how advanced packaging creativity is propelling AI forward by integrating higher performance chips within smaller form factors for transformative latency improvement and bandwidth enhancement.
2025 OCP APAC Summit Keynote - Meta
Jasmeet Bagga (Meta)
Networking for Multi-Region Distributed Training
As we continue to push the model sizes for LLMs, distributed training has become an essential component of our AI infrastructure. However, as we build clusters that consume power beyond the capability of a single datacenter region, new networking challenges emerge. This talk will explore the complexities of networking in a multi-region distributed training environment, where data is transmitted across long distances between datacenters. We will discuss the current state of distributed training, the limitations of traditional networking approaches, and the innovative solutions being developed to address these challenges.
2025 OCP APAC Summit Keynote - Google
Chris Verne (Google)
System-Level Security, Resiliency, and Validation: Powering Trust in the AI Era
As the complexity of modern systems skyrockets and AI deployments scale at an unprecedented pace, the imperative for robust security, resiliency, and reimagined validation becomes paramount. This keynote will explore how Google, in close collaboration with industry partners-many of whom are driving these efforts through OCP-is addressing these critical challenges. We'll highlight key advancements and collaborative initiatives (e.g., Caliptra, OCP L.O.C.K., OCP S.A.F.E., SDC academic research, et al), including significant contributions from our partners in Asia, particularly Taiwan, as we collectively build more secure, resilient, and trustworthy infrastructure for the age of AI.
2025 OCP APAC Summit Keynote - Broadcom
Ram Velaga (Broadcom)
Scale-up for AI: Balancing Compute, Memory and Networking
AI models are growing at an unprecedented pace, driving exponential increases in compute demands. As a single GPU can no longer handle these workloads, the challenge has become one of distributed computing-requiring highly scalable, high-performance network infrastructure.
To address this, both scale-up and scale-out architectures are being adopted, with Ethernet emerging as the preferred solution thanks to its scalability, resilience, and open ecosystem. While Ethernet is already the standard for scale-out networks, it is now proving equally powerful for scale-up environments.
At the OCP EMEA Summit, Broadcom introduced its Scale-Up Ethernet Framework, a significant contribution to the open hardware community. This presentation will outline the key components of this framework, showcase innovative products built on this architecture, and highlight how the community is collaborating to advance the future of AI infrastructure.